Materials for High-Density Electronic Packaging and Interconnection

National Research Council author Division on Engineering and Physical Sciences author Commission on Engineering and Technical Systems author National Materials Advisory Board author Committee on Materials for High-Density Electronic Packaging author

Format:Paperback

Publisher:National Academies Press

Published:1st Feb '90

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Materials for High-Density Electronic Packaging and Interconnection cover

This non-fiction paperback, "Materials for High-Density Electronic Packaging and Interconnection" from National Research Council, Division on Engineering and Physical Sciences, Commission on Engineering and Technical Systems, National Materials Advisory Board & Committee on Materials for High-Density Electronic Packaging, was published 1st February 1990 by National Academies Press.

ISBN: 9780309042338

Dimensions: unknown

Weight: unknown

156 pages