Electronic Packaging Materials and Their Properties

Rahul Mahajan author Michael Pecht author Sirus Javadpour author Rakish Agarwal author F Patrick McCluskey author Terrance J Dishongh author

Format:Hardback

Publisher:Taylor & Francis Inc

Published:18th Dec '98

Currently unavailable, and unfortunately no date known when it will be back

Electronic Packaging Materials and Their Properties cover

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

  • interconnections
  • printed circuit boards
  • substrates
  • encapsulants
  • dielectrics
  • die attach materials
  • electrical contacts
  • thermal materials
  • solders
    Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.<

    • ISBN: 9780849396250

    Dimensions: unknown

    Weight: 362g

    120 pages