3D Integration in VLSI Circuits
Implementation Technologies and Applications
Format:Hardback
Publisher:Taylor & Francis Ltd
Published:24th Apr '18
Currently unavailable, and unfortunately no date known when it will be back
This hardback is available in another edition too:
- Paperback£53.99(9781032095547)
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe.
- Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC.
- Discusses the use of silicon interposer and organic interposer.
- Presents architecture, design, and technology implementations for 3D FPGA integration.
- Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding.
- Addresses the issue of thermal dissipation in 3D integration. <
"With the increasing cost and power issues associated with continuing along the traditional road of 2D scaling, 3D integration is becoming an essential enabler for performance gains in future VLSI nodes. This book provides an insightful treatment of the challenges and opportunities for intelligently evolving 3D integration into volume manufacturing and the applications that will exploit this exciting technology."
—David Danovitch, Université de Sherbrooke, Canada
"The chapter authors are the world’s leading scientists and experts in this field and they cover the state-of-the-art topics that the readers really want."
— James J.-Q. Lu, Rensselaer Polytechnic Institute, USA
"With the increasing cost and power issues associated with continuing along the traditional road of 2D scaling, 3D integration is becoming an essential enabler for performance gains in future VLSI nodes. This book provides an insightful treatment of the challenges and opportunities for intelligently evolving 3D integration into volume manufacturing and the applications that will exploit this exciting technology."
—David Danovitch, Université de Sherbrooke, Canada
"The chapter authors are the world’s leading scientists and experts in this field and they cover the state-of-the-art topics that the readers really want."
— James J.-Q. Lu, Rensselaer Polytechnic Institute, USA
ISBN: 9781138710399
Dimensions: unknown
Weight: 521g
217 pages