MEMS Packaging Technologies and 3D Integration
Format:Hardback
Publisher:Mdpi AG
Published:1st Jun '22
Currently unavailable, and unfortunately no date known when it will be back

This hardback, "MEMS Packaging Technologies and 3D Integration" from Seonho Seok, was published 1st June 2022 by Mdpi AG.
ISBN: 9783036542584
Dimensions: 244mm x 170mm x 18mm
Weight: 653g
210 pages