MEMS Packaging Technologies and 3D Integration

Seonho Seok editor

Format:Hardback

Publisher:Mdpi AG

Published:1st Jun '22

Currently unavailable, and unfortunately no date known when it will be back

MEMS Packaging Technologies and 3D Integration cover

This hardback, "MEMS Packaging Technologies and 3D Integration" from Seonho Seok, was published 1st June 2022 by Mdpi AG.

ISBN: 9783036542584

Dimensions: 244mm x 170mm x 18mm

Weight: 653g

210 pages