Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect

Sunjung Kim author

Format:Paperback

Publisher:VDM Verlag

Published:23rd Dec '08

Currently unavailable, and unfortunately no date known when it will be back

Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect cover

This paperback, "Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect" from Sunjung Kim, was published 23rd December 2008 by VDM Verlag.

ISBN: 9783639111309

Dimensions: 229mm x 152mm x 8mm

Weight: 200g

144 pages