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Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications

Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)

Vikrant Bhateja editor Jaume Anguera editor Wendy Flores-Fuentes editor V V S S S Chakravarthy editor Anumoy Ghosh editor

Format:Hardback

Publisher:Springer Verlag, Singapore

Published:11th Dec '24

Currently unavailable, and unfortunately no date known when it will be back

Signal Processing, Telecommunication and Embedded Systems with AI and ML Applications cover

The book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication. It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2023), organized by Department of Electronics and Communication Engineering, National Institute of Technology Mizoram, India during 6 – 7 October 2023. The book is divided into two volumes, and it covers papers written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes from all over the world and share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

ISBN: 9789819784219

Dimensions: unknown

Weight: unknown

523 pages

2024 ed.